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Augmenting the Heat Sink for Better Heat Dissipation

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http://www.scirp.org/journal/PaperInformation.aspx?PaperID=54113#.VO2EhizQrzE

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ABSTRACT
Heat sinks were invented to absorb heat from an electronic circuit conduct, and then to dissipate or radiate this heat to the surrounding supposedly, ventilated space, at a rate equal to or faster than that of its buildup. Ventilation was not initially recognized as an essential factor to thermal dispersion. However, as electronic circuit-boards continued to heat up, circuit failure became a problem, forcing the inclusion of miniaturized high speed fans. Later, heat sinks with fins and quiet fans were incorporated in most manufactured circuits. Now heat sinks come in the form of a fan with fans made to function as fins to disperse heat. Heat sinks absorb and radiate excess heat from circuit-boards in order to prolong the circuit’s life span. The higher the thermal conductivity of the material used the more efficient and effective the heat sink is. This paper is an attempt to theoretically design a heat sink with a temperature gradient lower than that of the circuit board’s excess heat.
 
Cite this paper
Ashry, M. (2015) Augmenting the Heat Sink for Better Heat Dissipation. Circuits and Systems, 6, 21-29. doi: 10.4236/cs.2015.62003.
 
References
[1]http://WATLOW.COM
 
[2]http://encyclopedia2.thefreedictionary.com/thermodynamics+processes
 
[3]Lee, S. How to Select a Heat Sink. Advanced Thermal Engineering, Aavid Thermal Technologies, Inc., Laconia.
 
[4]Hamburgen, W.R. (1986) Optimal Finned Heat Sinks. Digital Equipment Corporation, Western Research Laboratory, Palo Alto.
 
[5]Sridhar, R. (2011) Discretization of Convection-Diffusion Type Equation. 10th Indo-German Winter Academy, Indian Institute of Technology, Madras.
 
[6]ICT International Pty Ltd. Theory of Emissivity. DocRef: Ver 1.1, Armidal NSW 250, Australia.
www.ictinternational.com.au
 
[7]Qu, W. and Mudawar, I. (2002) Analysis of Three Dimensional Heat Transfer in Micro-Channel Heat Sinks. School of Mechanical Engineering, Purdue University, West Lafayette.
 
[8]Haskel, M.D. Thermal Resistance Comparison of Graphite Foam, Aluminum, and Copper Heat Sinks.
http://www.electronics-cooling.com/2006/02/thermal-resistance-comparison-
of-graphite-foam-aluminum-and-copper-heat-sinks/                                  eww150225lx
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