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http://www.scirp.org/journal/PaperInformation.aspx?PaperID=53680#.VM8xdizQrzE
Author(s)
Affiliation(s)
1Department of Mechanical Engineering, Inha University, Incheon, Republic of Korea.
2Division of Mechanical Engineering, Inha University, Incheon, Republic of Korea.
ABSTRACT
In semiconductor manufacturing process, probe station that is testing equipment is important. Inspection step is for detecting defects on semiconductor before the packaging. Probe card is a part of probe station and contains probe tip that contacts to semiconductor. Through probe tip, it can inspect defects of semiconductor. In this paper, optimization method is used with response surface analysis to design MEMS type probe tip. And fabricating probe tip uses maskless lithography, electro-plating and lapping process.
KEYWORDS
A Study of Design Optimization Using Response Surface Analysis and Fabricaiton MEMS Probe Tip
Cite this paper
Kim, K. , Lee, J. , Ha, S. , Cho, Y. and Cho, M. (2015) A Study of Design Optimization Using Response Surface Analysis and Fabricaiton MEMS Probe Tip. Journal of Applied Mathematics and Physics, 3, 201-207. doi: 10.4236/jamp.2015.32030.
References
http://www.scirp.org/journal/PaperInformation.aspx?PaperID=53680#.VM8xdizQrzE
Author(s)
Affiliation(s)
1Department of Mechanical Engineering, Inha University, Incheon, Republic of Korea.
2Division of Mechanical Engineering, Inha University, Incheon, Republic of Korea.
ABSTRACT
In semiconductor manufacturing process, probe station that is testing equipment is important. Inspection step is for detecting defects on semiconductor before the packaging. Probe card is a part of probe station and contains probe tip that contacts to semiconductor. Through probe tip, it can inspect defects of semiconductor. In this paper, optimization method is used with response surface analysis to design MEMS type probe tip. And fabricating probe tip uses maskless lithography, electro-plating and lapping process.
KEYWORDS
A Study of Design Optimization Using Response Surface Analysis and Fabricaiton MEMS Probe Tip
Cite this paper
Kim, K. , Lee, J. , Ha, S. , Cho, Y. and Cho, M. (2015) A Study of Design Optimization Using Response Surface Analysis and Fabricaiton MEMS Probe Tip. Journal of Applied Mathematics and Physics, 3, 201-207. doi: 10.4236/jamp.2015.32030.
References
| [1] | Ha, S.J., Kim, D.W., Shin, B.C., Cho, M.W. and Han, C.S. (2010) Assessment of Design and Mechanical Characteristics of MEMS Probe Tip with Fine Pitch. Journal of Academia-Industrial Technology, 11, 1210-1215. |
| [2] | Leslie, B. and Matta, F. (1989) Wafer-Level Testing with a Membrane Probe. IEEE Design & Test of Computers, 6, 10-17. |
| [3] | Min, C.H. (2007) Fabrication of Vertical Type Probe Card and MEMS Probe Card for Wafer Level Chip Test. Catholic University. |
| [4] | Kendall, D.L. (1975) On Etching Very Narrow Grooves in Silicon. Appl. Phys. Lett., 26, 195-198. http://dx.doi.org/10.1063/1.88113 |
| [5] | Kim, I.G. (2004) Study on the Hardness and Internal Stress of Nickel Electro-deposit. Industrial of Telecommunication Information, 47-56. eww150202lx |
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